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This two day event covers five themes (Speakers announced to date)

Refining the PIC: Achieving the Next Milestone PIC Design, Simulation and Packaging:
in Performance A Blueprint for Future Success
What are the leading approaches for integrating key building blocks How can we implement ideas faster and what needs to be considered
at the chip-level and how can we bring together electronics and to keep the final device cost on track?
photonics more efficiently?
SPEAKERS
SPEAKERS £ Peter O’Brien: Tyndall National Institute
£ Michael Lebby: Lightwave Logic PIXAPP – Open Access Opportunities for Advanced PIC Packaging
Scalable PIC platforms: The impact of using polymer PICs for £ Christopher Cone: Mentor Graphics
100 and 400Gbps datacom applications From schematic to layout – overcoming today’s PIC design
£ Wim Bogaerts: Ghent University/imec challenges
Programmable photonic ICs: making optical devices more versatile £ André Richter: VPIphotonics
£ Luis Henrique Hecker de Carvalho: BrPhotonics Scalable design of integrated photonic and optoelectronic circuits
Converging photonics and microelectronics: applying advanced
technologies to ramp up PIC performance PIC Horizons: New and Emerging Applications
£ Tan Yong Tsong: Institute of Microelectronics for Integrated Photonics
Coupling electronics and photonics – promising paths for How can developers capitalize on opportunities for optical platforms
device-makers to explore in growth areas such as medical diagnostics, industrial sensing and
£ Radha Nagarajan: Inphi biological analysis?
Highly integrated silicon photonics to push PICs to the next level
£ Sasan Fathpour: CREOL, The College of Optics & Photonics SPEAKERS
Silicon photonics beyond silicon-on-insulator - emerging solutions £ Milan Mashanovitch: Freedom Photonics
for integrated photonics Low size, weight and power (SWaP) instruments for sensing
£ Yvain Thonnart: CEA-Leti applications - cutting edge PICs
Integrating photonic building blocks towards complete £ Sascha Geidel: Fraunhofer ENAS
electro-optical computing Adding the ‘tech’ to biotech - opportunities for photonic integrated
£ Shinji Matsuo: NTT Photonics circuits
III-V membrane lasers on silicon for datacom and computercom £ Andrew Sparks: Analog Devices
applications Putting liquid crystal waveguides in the fast lane automotive
applications for PICs
Moving the Data: PICs for Cloud Computing
and Telecoms Delivering the goods: Advances in PIC
Data centres and networks need smart solutions to manage the sharp Manufacturing
growth in traffic. What can integrated photonics bring to the table What are the latest tools and techniques that can be deployed in the
and how can developers make sure their products appeal to key fab? And what are the options when it comes to evaluating the output?
customers?
SPEAKERS
SPEAKERS £ Jessie Rosenberg: IBM
£ Vincent Zeng: Facebook Inline wafer-scale photonic testing to boost PIC manufacturing
PIC opportunities for datacentres efficiency
£ Yuichi Nakamura: NEC Corporation £ Jack Xu: Finisar
Big data analysis - a golden opportunity for silicon photonics Meeting the challenge of producing PICs at high-volume
£ Martin Schell: Fraunhofer HHI £ Arne Leinse: LioniX International
The Zettabyte is not enough: Volume handling for InP, Silicon nitride based TriPleX PIC modules in a broad range
silicon photonics, and hybrid photonic integration of applications
£ Weiming Yao: JePPIX/PITC £ Henk Bulthuis: Kaiam Corporation
III-V photonic integrated circuits for telecoms and beyond Vertical integration: bringing key elements together to match
£ Peter Winzer: Nokia Bell Labs PICs to the market
Massive array integration and the need for a holistic digital/analog £ Scott Jordan, Physik Instrumente
optics/electronics co-design Presentation title TBC
£ Eric Mounier: Yole Développement
Data centre technology - the big PICture, opportunities for
energy efficient photonics

Panel: Has Silicon Photonics got the Required Panel: High Volume Transceiver Opportunities for PICs
Scalability to Displace InP? Will transceivers ever achieve super high volumes to allow
Silicon photonics has attracted the interest of many in large scalability in cost and performance, and if so, what would be the
corporations, SMEs, and academics as a potential replacement common large volume platforms, and more specifically, what
to the incumbent PIC technology InP. Given these conditions, would be the transceiver format/form factor?
the question remains to ask if SiP can be truly scalable towards
$1/Gbps at 400Gbps data rates and above (for any distance)? Aref Chowdhury – Nokia
Bert Jan Offrein – IBM Drew Nelson – IQE
Di Liang - Hewlett Packard Enterprise Vipul Bhatt – Finisar
Robert Blum – Intel
Sean Anderson – Cisco

All speakers and presentations are subject to change. ©2017 Angel Business Communications Ltd.

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