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10-11 APRIL 2018

Sheraton Airport Hotel Brussels

Connecting, informing and inspiring the HIGH END SENSOR industry

HIGH END SENSORS INTERNATIONAL

CONFERENCE 2018 Book your place NOW!

It’s set to be a sellout

The inaugural High End Sensors conference will be held at the Sheraton Airport

Hotel in Brussels on 10 -11 April 2018. HES International will be held
alongside CS international and PIC International.

High-end sensor devices are an increasingly significant share of the global machine sensory market that
is expected to exceed 30 billion devices by 2020 with revenue of (USD) $20 billion. We will explore The 8th CS International conference will build on the success of its predecessors, with industry-leading insiders
delivering more than 30 presentations spanning five sectors.
opportunities for the most advanced sensors that deliver higher performance, ruggedness and longer
operational lifetimes. We will examine new technologies that are cutting costs while increasing Together, these talks will detail breakthroughs in device technology; offer insights into the current status and the
effectiveness. We will explore product development within major high-end sensor categories and ways evolution of compound semiconductor devices; and provide details of advances in tools and processes that will
help to drive up fab yields and throughputs.
that researchers and manufacturers are investigating to enhance performance, reduce power consumption,
and improve efficiency. Attendees at this two-day conference will gain an up-to-date overview of the status of the CS industry, and have
opportunities to meet many other key players within this community.

Two days, 10 topics, over 25 inspiring presentations

The presentations will be based around ten topics which Photonic Integrated Circuits International
collectively provide complete coverage of the high-end £ Bernhard Straub Infineon Technologies Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres.
sensor market. £ Rainer Minixhofer AMS AG To aid this industry, we are strengthening the relationships between the makers and the users of these integrated
£ Tristan Rousselle Aryballe Technologies circuits by organising the 3 PIC International, a global conference dedicated to this industry.
rd
£ Defence, Security, Aviation and Aerospace High-End £ Henry White BAE Systems
Sensors £ Pierre-Damien Berger CEA-Leti Attendees to the conference will hear industry-leading insiders delivering more than 30 presentations spanning
£ Imaging and Optical Sensing Advances £ Nicholas Burgwin Fibos five sectors. The conference will equip the delegates with an up-to-date overview of the status of the PIC industry,
£ Maximizing Sensor Data Acquisition and Analysis £ Wilmuth Muller Fraunhofer IOSB and provided them with many opportunities to meet other key players within this community.
£ Optimizing IoT and IIoT Sensor Networks and £ Richard Dixon IHS Markit
Security £ Denis Pasero Ilika Technologies 3/2/1 Register for one conference and gain access to THREE cutting edge complimentary events plus ONE
dedicated exhibition featuring leading industry players from across the globe.
£ New Approaches for Power Control and Energy £ Wim Van Thillo imec
Harvesting £ Marianne Vandecasteele imec Registration at one conference allows access to all other conference sessions
£ Radar and LiDAR Innovations
£ Advances in MEMS Sensor Development £ Sergey Yurish IFSA
£ Metrology and Test for High-End Sensors £ Speaker TBC IST AG PLATINUM SPONSORS MEDIA SPONSORS
£ Enhancing Sensor Performance: Embedded, SoC £ Sergio Nicoletti MIRPHAB
and Machine Learning £ Johan Pedersen Sigma Designs GeoConnexion
£ Emerging Opportunities and Applications £ Speaker TBC Evatec
£ Pim Kat Technobis
https://highendsensors.net/home £ Peter O’Brien Tyndall National Institute WIFI SPONSOR SUPPORTED BY
£ Iwan Davies VIDaP Consortium
£ Iñigo Artundo VLC Photonics

All speakers and presentations are subject to change. ©2017 Angel Business Communications Ltd.

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