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10-11 APRIL 2018 This two day event covers five themes (Speakers announced to date)
Sheraton Airport Hotel Brussels Refining the PIC: Achieving the Next Milestone PIC Design, Simulation and Packaging:
in Performance A Blueprint for Future Success
Creating and strengthening links between chipmakers and network builders What are the leading approaches for integrating key building blocks How can we implement ideas faster and what needs to be considered
at the chip-level and how can we bring together electronics and
to keep the final device cost on track?
photonics more efficiently?
PIC INTERNATIONAL 2018 CONFERENCE SPEAKERS SPEAKERS
£ Peter O’Brien: Tyndall National Institute
£ Michael Lebby: Lightwave Logic
PIXAPP – Open Access Opportunities for Advanced PIC Packaging
SPEAKERS ANNOUNCED! Scalable PIC platforms: The impact of using polymer PICs for £ Christopher Cone: Mentor Graphics
From schematic to layout – overcoming today’s PIC design
100 and 400Gbps datacom applications
£ Wim Bogaerts: Ghent University/imec
challenges
Programmable photonic ICs: making optical devices more versatile
Scalable design of integrated photonic and optoelectronic circuits
£ Luis Henrique Hecker de Carvalho: BrPhotonics £ André Richter: VPIphotonics
With a record breaking number of speakers and sponsors secured, Converging photonics and microelectronics: applying advanced
technologies to ramp up PIC performance PIC Horizons: New and Emerging Applications
PIC International 2018 is set to be the biggest and best yet £ Tan Yong Tsong: Institute of Microelectronics for Integrated Photonics
Coupling electronics and photonics – promising paths for How can developers capitalize on opportunities for optical platforms
device-makers to explore in growth areas such as medical diagnostics, industrial sensing and
On Tuesday 10 and Wednesday 11 April 2018 £ Moving the data: PICs for cloud £ Radha Nagarajan: Inphi biological analysis?
in Brussels at the Sheraton Airport Hotel, computing and telecoms Highly integrated silicon photonics to push PICs to the next level
PIC International will once again be the must-attend £ Sasan Fathpour: CREOL, The College of Optics & Photonics SPEAKERS
event for the global integrated photonics community. £ Refining the PIC: achieving the next Silicon photonics beyond silicon-on-insulator - emerging solutions £ Milan Mashanovitch: Freedom Photonics
milestone in performance for integrated photonics Low size, weight and power (SWaP) instruments for sensing
Highlights include talks by Facebook, Nokia-Labs, £ Delivering the goods: advances in £ Yvain Thonnart: CEA-Leti applications - cutting edge PICs
imec, PhoeniX Software, Finisar, IBM, NEC Integrating photonic building blocks towards complete £ Sascha Geidel: Fraunhofer ENAS
Corporation, Hewlett Packard Enterprise, Intel, plus PIC manufacturing electro-optical computing Adding the ‘tech’ to biotech - opportunities for photonic integrated
many more... £ PIC Design, simulation and packaging: £ Shinji Matsuo: NTT Photonics circuits
A blueprint for future success III-V membrane lasers on silicon for datacom and computercom £ Andrew Sparks: Analog Devices
Delivering over 30 presentations £ PIC horizons: new and emerging applications Putting liquid crystal waveguides in the fast lane automotive
PIC International will provide applications for integrated photonics applications for PICs
comprehensive coverage of the Moving the Data: PICs for Cloud Computing
PIC industry exploring 5 core themes and Telecoms Delivering the goods: Advances in PIC
For each theme a keynote presentation will be given by the leading Data centres and networks need smart solutions to manage the sharp Manufacturing
decision makers and influencers within the industry. growth in traffic. What can integrated photonics bring to the table What are the latest tools and techniques that can be deployed in the
and how can developers make sure their products appeal to key fab? And what are the options when it comes to evaluating the output?
customers?
SPEAKERS
Book your place NOW! SPEAKERS £ Jessie Rosenberg: IBM
£ Vincent Zeng: Facebook
Inline wafer-scale photonic testing to boost PIC manufacturing
PIC opportunities for datacentres
£ Jack Xu: Finisar
£ Yuichi Nakamura: NEC Corporation efficiency
www.picinternational.net/register to secure your place Big data analysis - a golden opportunity for silicon photonics Meeting the challenge of producing PICs at high-volume
£ Arne Leinse: LioniX International
£ Martin Schell: Fraunhofer HHI
It’s set to be another sellout The Zettabyte is not enough: Volume handling for InP, Silicon nitride based TriPleX PIC modules in a broad range
of applications
silicon photonics, and hybrid photonic integration
£ Weiming Yao: JePPIX/PITC £ Henk Bulthuis: Kaiam Corporation
III-V photonic integrated circuits for telecoms and beyond Vertical integration: bringing key elements together to match
PLATINUM SPONSORS £ Peter Winzer: Nokia Bell Labs PICs to the market
Massive array integration and the need for a holistic digital/analog £ Scott Jordan, Physik Instrumente
optics/electronics co-design Presentation title TBC
£ Eric Mounier: Yole Développement
Data centre technology - the big PICture, opportunities for
energy efficient photonics
LOGO TEEM ROND INDD
GOLD SPONSORS Panel: Has Silicon Photonics got the Required Panel: High Volume Transceiver Opportunities for PICs
Scalability to Displace InP? Will transceivers ever achieve super high volumes to allow
Silicon photonics has attracted the interest of many in large scalability in cost and performance, and if so, what would be the
corporations, SMEs, and academics as a potential replacement common large volume platforms, and more specifically, what
MEDIA SPONSORS to the incumbent PIC technology InP. Given these conditions, would be the transceiver format/form factor?
the question remains to ask if SiP can be truly scalable towards
$1/Gbps at 400Gbps data rates and above (for any distance)? Aref Chowdhury – Nokia
Bert Jan Offrein – IBM Drew Nelson – IQE
Di Liang - Hewlett Packard Enterprise Vipul Bhatt – Finisar
WIFI SPONSOR DELEGATE BAG SPONSOR LANYARD SPONSOR SUPPORTED BY Robert Blum – Intel
Sean Anderson – Cisco
All speakers and presentations are subject to change. ©2017 Angel Business Communications Ltd.
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