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季刊 2018年第2期 2018年6月7日出版 Contents
Quarterly 2018 - Issue 2 7 Jun 2018
封面故事 Cover Story
08 GaAs为5G手机提供关键组件
GaAs provides the key ingredient for 5G phones
- Ben Thomas, QORVO
业界动态 Industry
快速. 03 5G与汽车科技带动SiC与GaN的发展
5G and automotive technologies drive the development of SiC and GaN
04 终极磁传感器即将问世?
靈活. The ultimate magnetic sensor?
06 小巧高效的GaN器件即将跻身主流市场
GaN: small, efficient and market-ready
專業. 技术Technology
12 3D集成: 整合InP,GaN和硅CMOS
3D integration unites InP, GaN and silicon CMOS
- Andrew Carter, Miguel Urteaga, TELEDYNE SCIENTIFIC AND IMAGING
16 改善UVC LED的热管理
Improving the thermal management of UVC LEDs
一間植入 - John Cafferkey, CAMBRIDGE NANOTHERM
20 优化GaN HEMT生产
體鑄造廠 Refining production of the GaN HEMT
- Richard Stevenson
可滿足您 24 GaN功率器件:完善垂直架构
GaN power devices: Perfecting the vertical architecture
的所有 - Yuhao Zhang, Min Sun, Tomás Palacios, 麻省理工学院
科技前沿 Research Review
需求。 29 加快 GaN 的生长速度
Accelerating GaN growth
30 UV LED 的输出功率超过 1 W
UV LEDs exceed 1W output
31 了解 microLED 的不足
Understanding microLED deficiencies
02 编者话Editorial
32 广告索引Advertisement Index
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www.compoundsemiconductorchina.net 化合物半导体 2018年第2期 1