本期内容
2016年第四期
封面故事 Cover Story
采用GaN数字功率放大器的先进无线通讯技术
Advancing wireless with the digital GaN PA
- Andreas Wentzel, FBH BERLIN
市场 Market
检测能够促使器件市场增长达到最大化
Metrology: making the most of market growth
光子集成电路(PIC): 
芯片制造技术上的选择
PIC: options for lighting up the chip
整合优势资源,促进第三代半导体产业发展
Integrating advantage resources to promote the development of the third generation semiconductor industry
技术 Technology
通过监测晶圆载体来提高芯片制造的性能
Refining chip manufacturing with wafer carrier monitoring
- Carrie Andre, Darryl Barlett; K-SPACE ASSOCIATES
用于空气污染物检测的GaN HEMT
Exposing pollutants with GaN HEMTs
- Peter Offermans, IMEC
科技前沿 Research Review
光电晶体管在自由空间通信中的应用
Phototransistor targets free-space communication
氮化物和砷化物与硅CMOS的集成
Integrating nitrides and arsenides with silicon CMOS
采用双层ITO来提高LED的亮度
Dual layer ITO boosts LED brightness
大幅降低半极性LED的成本
Slashing the cost of semi-polar LEDs
编者话 Editorial
IR LED带动LED市场成长
广告索引 Advertisement Index
广告索引
Advertisement Index