本期内容
2019年第一期
封面故事 Cover Story
MACOM促进5G实施
MACOM facilitating 5G
Doug Carlson, MACOM 公司
业界动态 Industry
连续渗透合成:
更少的工艺步骤，更精细的特征图形
Sequential infiltration synthesis: fewer process steps, finer features
MACOM和ST携手合作提高硅基GaN产能，支持5G无线网络建设
MACOM and STMicroelectronics to extend the capacity of GaN-onsilicon and support the construction of 5G wireless network
潜力巨大的 MicroLED
MicroLEDs with mammoth potential
--Rebecca Pool 报道
山东天岳碳化硅功率半导体芯片项目开工，推进碳化硅产业化
SICC started SiC power semiconductor chip project to promote the industrialization of SiC
SEMI发布业界首个功率和化合物Fab厂预测报告
SEMI Unveils Industry's First Power and Compound Fab Outlook
技术 Technology
在200毫米硅晶圆上制备microLED
Making microLEDs on 200 mm silicon
Liyang Zhang, Kai Liu, Peng Xiang, Hongjing Huo, Ni Yin, Kai Cheng; 苏州晶湛半导体有限公司
通过纳米脊形获得优势
Gaining an edge with nano-ridges
ardette Kunert, Robert Langer, Marianna Pantouvaki, Joris Van Campenhout; IMEC Dries Van Thourhout, 比利时根特大学
园艺行业:
引人注目的 LED 应用场合
Horticulture: The compelling case for LEDs
Alexander Wilm, 欧司朗光电半导体公司
科技前沿 Research Review
利用 ITO 改善紫外 LED
Improving ultraviolet LEDs with ITO
仔细观察厚的 AlInN 薄膜
Scrutinising thick films of AlInN
更好的缓冲器可提高激光器寿命
Better buffers boost laser lifetimes
编者话 Editorial
5G技术争霸战拉开序幕
The battle for 5G begins
赵雪芹
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