本期内容
2021年04/05月刊
封面故事 Cover Story
GaSb基芯片有望实现传感革命
GaSb-based chips promise a sensing revolution
KRISTIJONAS VIZBARAS,BROLIS传感科技
编者话 Editorial
碳化硅的“上车”之路
The road of silicon carbide "on the car"
陆敏
业界动态 Industry
小米进军智能电动汽车行业 10年投资100亿美元
Xiaomi enters the smart electric vehicle industry, invests 10 billion US dollars in 10 years
英特尔将在未来6-9月内开始生产汽车芯片
Intel will start producing automotive chips in the next 6-9 months
SEMI报告: 
2020年全球半导体设备销售额激增19%,达到712亿美元 的行业新高
SEMI report: Global semiconductor equipment sales surge 19% in 2020, reaching an industry high of 71.2 billion US dollars
湖南大学无锡半导体先进制造研究院签约落户锡山区
Wuxi Semiconductor Advanced Manufacturing Research Institute of Hunan University signed a contract to settle in Xishan District
湖南十四五规划纲要出台: 
设定全国最大碳化硅全产业链生产基地目标
Hunan's Fourteenth Five-Year Plan Outline: Set the goal of the country's largest production base of silicon carbide industry chain
华域三电与罗姆成立“技术联合实验室”并举行启动仪式
Huayu Sanden and ROHM established "Technology joint Laboratory" and held a launching ceremony
总投资10亿元 采埃孚电驱动制造项目开工
With a total investment of 1 billion yuan, the ZF electric drive manufacturing project starts
2020年AXT收入增长15%
AXT Revenue Grows 15 Percent Year-on-Year
宽禁带半导体国家工程研究中心专栏 WBS Column
科技前沿 Research Review
技术 Technology
纳米多孔GaN助力microLED
Nano-porous GaN enhances microLEDs
JIE SONG和CHEN CHEN,SAPHLUX
新冠肺炎喜忧参半
Covid-19 delivers a mixed blessing
理查德•史蒂文森(Richard Stevenson)
用纳米线瞄准电信
Targeting telecoms with nanowires
张国强,NTT公司
扩展GaN功率放大器的带宽
Stretching the bandwidth of GaN power amplifiers
理查德•史蒂文森(Richard Stevenson)
九峰山实验室专栏 JFS Laboratory Column
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