本期内容
2022年12/2023 1月刊
封面故事 Cover Story
用复合晶体管开辟新天地
Breaking new ground with the hybrid transistor
国家先进工业科学技术研究所,Akira NAKJIMA
编者话 Editorial
超宽禁带半导体之AlN
AlN of Ultra Wide Bandgap Semiconductors
Wolfspeed专栏 Wolfspeed Column
优化汽车应用的驾驶循环仿真
Optimizing Drive-Cycle Simulations for Automotive Applications
业界动态 Industry
应科院成立「微电子技术联盟」 构建微电子与半导体生态系统
NAstri established the Microelectronics Technology Alliance to build the microelectronics and semiconductor ecosystem
安森美提高SiC产量
Onsemi ramps SiC production
晶湛半导体完成数亿元C轮融资
Enkris Semiconductor completed C round financing of hundreds of millions RMB
意法半导体与Soitec合作开发碳化硅衬底制造技术
STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology
英国命令安世半导体剥离纽波特晶圆厂
UK orders Nexperia to divest Newport Wafer Fab
SEMI报告: 
2022年第三季度全球半导体设备出货金额增长9%
SEMI reports: Global semiconductor equipment shipments grew 9% in Q3 2022
碳化硅将服务客车和卡车
SiC to service buses and trucks
技术 Technology
通过衬底驱动应变调控为高性能UVB-LED的制备铺平道路
Paving the Way for High-Performance UVB-LEDs Through Substrate-Dominated Strain-Modulation
碳化硅促进航空电子系统设计演进
Silicon carbide facilitates the evolution of avionics system design
氧化镓晶体生长方法的选择
Weighing up the options for gallium oxide crystal growth
将microLED与先进CMOS集成
Integrating microLEDs with advanced CMOS
科技前沿 Research Review
HVPE为高质量AlGaN生长提供了一条新途径
HVPE offers a new route to high-quality AlGaN
SiN降低了高速HEMT的电阻
SiN trims the resistance of high-speed HEMTs
剥离AlGaN薄膜
Exfoliating AlGaN films
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