本期内容
2024年 2/3 月刊
封面故事 Cover Story
基于非极性氮化铝单晶薄膜的高速表面声波和横向体波谐振器
High speed surface acoustic wave and laterally excited bulk wave resonator based on single-crystal non-polar AlN film
编者话 Editorial
VCSEL技术和产业化进展
The progress of VCSEL technology and industrialization
业界动态 Industry
全球最大的SiC晶圆厂
The world's biggest SiC fab
X-FAB出资2250万欧元收购Xtrion的M-MOS
X-FAB acquires M-MOS from Xtrion for 22.5m
近40万片!天域半导体冲刺投产
Nearly 400,000 SiC wafers! TYSiC sprint into production
芯联集成与蔚来汽车签署碳化硅生产供货协议
UNT and NIO signed a silicon carbide production supply agreement
宽禁带半导体国家工程研究中心专栏 WBS Column
国家工程中心平台介绍
Introduction of National engineering center platform
高端访谈 Top interview
郝跃院士专访 ——宽禁带半导体技术突飞猛进,产业蓬勃发展,未来任重道远
Interview with Academician Hao Yue-- WBS technology advancing, WBS industry booming, and long way to go in future
展望2024
looking forward to 2024
技术 Technology
Marangoni干燥技术的新应用
New Applications of Marangoni Drying Technology
科技前沿 Research Review
利用深紫外光推进通信的发展
Advancing communication in the deep UV
实现垂直型深紫外激光器
Realising vertical deep-UV lasers
转向单片多色microLED阵列的隧道结
Turning to tunnel-junctions for monolithic multicolour microLED arrays
九峰山实验室专栏 JFS Laboratory Column
氮化镓功率集成电路技术
GaN Power Integration Technology
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